Microelectronics Numerical Simulation Engineer

Minimum qualifications:

• Bachelor's degree in mechanical engineering, a related engineering field or equivalent practical experience.
• 8 years of experience in manufacturing of microelectronics packaging (e.g., multi-chip modules, silicon photonics).
• Experience in thermomechanical reliability and mechanical drop or shock simulation.
• Experience in finite element analysis and programming languages, such as Ansys (e.g., APDL, Workbench, Icepak).

Preferred qualifications:

• Master's degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
  
• Experience in performing risk assessments based on failure data and incomplete information.
• Experience in test vehicles and experimental validation of simulation models.
• Experience in statistical software tools, computational fluid dynamics, Flotherm, Abaqus, MATLAB, and Python.
• Experience working in cross-functional internal and external engineering teams.

In this role, you will drive the cutting edge of technology and simulation capabilities to rapidly deliver design guidelines, risk assessments, and material/geometry recommendations for hardware devices used in Google Technical Infrastructure. You will be exposed to the depth and breadth of the advanced technologies currently deployed and are on Google’s product roadmap.

You will be part of the resident Subject Matter Experts (SMEs) in advanced numerical analysis for supply chain operations in Google Technical Infrastructure. You will learn and grow in your career while delivering exceptional value to Google Technical Infrastructure.

Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.

The US base salary range for this full-time position is $134,000-$198,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

• Partner with key stakeholders internally and externally to develop numerical models to understand manufacturing and reliability tradeoffs.
• Develop scalable numerical models to capture different failure modes and physics phenomena expected during the entire microelectronics device lifecycle: design, testing, assembly, test, field operation.
• Partner with thermal, packaging, test, manufacturing and quality engineers to develop validated simulation-based design guidelines to ensure rapid and reliable deployment of microelectronics assemblies.
• Execute test vehicles to generate experimental data required for model validation and enhancement.
• Participate in the development of roadmaps of materials, models, and infrastructure required to scale numerical models in local and cloud based simulation environments. Attend conferences, standards bodies, and other industry forums to keep abreast of the latest developments in numerical analysis.