Failure Analysis Engineer, Materials and Defect Analysis, Raxium

Minimum qualifications:

• Master's degree in Electrical Engineering, Materials Science, Physics, a related field, or equivalent practical experience.
• 2 years of experience in a research setting or industry, operating electron (SEM, FIB, TEM) and optical microscopes.
• 2 years of experience in a research setting or industry with examining microscopic features and creating comprehensive reports.

Preferred qualifications:

• 3 years of industry experience in material characterization/failure analysis.
• Experience working with image processing fundamentals and computer vision techniques utilizing software (e.g., Python, MATLAB, etc.).
• Experience working with optoelectronic characterization/FA techniques including Electroluminescence (EL) Fluoroscence (FL), Cathodoluminescence (CL), Electron beam induced current (EBIC), etc.
• Working knowledge of epitaxial growth, crystal structures, defects, and surface chemistry.
• Understanding of material characterization techniques such as EDS, XPS, SIMS, APT.

As a Failure Analysis Engineer, you will stand at the intersection of process development, yield enhancement, and reliability, serving as a critical resource for driving continuous improvement within semiconductor manufacturing. Your primary responsibility will be to meticulously analyze and characterize defects that impact device performance, employing a diverse range of advanced material characterization techniques. This includes leveraging sophisticated tools such as SEM, FIB, TEM, EDS, XPS, and AFM to delve into the intricate details of material microstructure and surface properties. Through failure analysis, you will identify defect patterns and trends, carefully organizing and managing microscopic images to facilitate correlative and root-cause studies. You will collaborate closely with process development, process integration, yield, and reliability teams, providing actionable insights and recommendations for process improvements. Additionally, you will contribute to the development and optimization of failure analysis protocols, staying abreast of the latest advancements in analytical techniques. Ultimately, your role will be to unravel the mysteries of device failures, providing the essential information needed to enhance product quality, yield, and reliability.

Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.

The US base salary range for this full-time position is $122,000-$178,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

• Use microscopy and material science to link LED defects to properties and processes, finding root causes.
• Partner with FA, improve analysis, create methods, and ensure consistent execution with instructions.
• Evaluate data obtained from diverse analytical techniques (e.g., SEM, TEM, EDS, AFM) building understanding of defect characteristics and their impact on display performance. Correlate findings from multiple sources to draw conclusions about defect formation mechanisms and potential failure modes.
• Conduct detailed analyses of defect nature, location, and morphology to identify potential root causes, including examining microscopic images, analyzing elemental compositions, and correlating defect characteristics with process steps to investigate the most likely origins of observed issues.
• Document analysis findings, presenting them to engineers and technicians. Create comprehensive reports, presenr data visualizations, and facilitate discussions ensuring effective communication and knowledge transfer, driving process improvements and defect reduction.