Thermal Design Engineer II, Platforms, Google Cloud

Minimum qualifications:

• Bachelor's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
  
• Experience designing mechanical components such as plastic or metal parts, mechanical assemblies, printed circuit boards, or flexes.
  
• Experience using computer-aided design (CAD) tools such as 3D MCAD, NX, Creo, or Solidworks.
  

Preferred qualifications:

• Master's degree in Mechanical, or Thermal Engineering.
• 4 years of experience in thermal design, analysis and validation of server systems and products.
• Experience in working with cooling strategies used for packages, boards, systems and data centers.
• Experience in designing and analyzing for thermal engineering fundamentals with heat transfer and fluid dynamics.
• Experience in capturing temperature, pressure, velocity, power, flow rates, sound, FloTHERM, IcePak, and CAD experience.
• Excellent communication and presentation skills in English.

Our computational challenges are so big and unique we can't just buy our hardware, we've got to make it ourselves. Our Platforms Team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Mechanical Engineer you design and evaluate our data center systems, identifying product requirements and contributing to research and project planning. From the chip to chiller, you are responsible for designing and optimizing an architecture that will scale with Google's continued growth.

Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.

• Contribute to overall system architecture from chip to chiller with the interdisciplinary tradeoffs to optimize Total Cost of Ownership (TCO) of overall compute infrastructure.
• Develop holistic thermal/mechanical/system designs from package to data center level optimizing for cost and efficiency while innovating for performance.
• Design thermal management hardware including material selection, heat sinks, heat exchangers, air movers, pumps, and all supporting equipment.
• Develop appropriate specifications and test procedures as necessary to ensure desired reliability and performance of electronic equipment, collaborate, supervise, mentor, and motivate suppliers to design and develop excellent products and mentor engineers in all aspects of concept development, analysis, design, and specification.